RYAN TECHNOLOGY

 

THERMAL PAD

Product: it's the high thermal conductivity Pad by using carbon fiber oriented-production technology; also obtained excellent performance both in thermal conductivity and elastic properties than traditional product. It’s created by filling carbon-based materials into silicon resin.

Application:
1.Auto-electronic cooling of heat generating components,, such as electronic parts, semiconductor memory devices, etc.;
2.General-purpose inverter, Medical equipments, DSC.;
3.Auto-electronic, such as Car-mounted camera, motor control unit, car navigation, automotive lighting (LED).;
4.Luminous source of laser HUD.;
5.Consumer microelectronics and hand held electronic device such as mobile phone, computer, etc.;
6.Base station, IGBT module

Specification:

 

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